发明名称 DEVICE FOR PLATING MAGNETIC DISK SUBSTRATE
摘要 PURPOSE:To obtain the titled device capable of electroless-plating a substrate without any defects by rotating circumferentially an oscillating shaft having a recessed groove for supporting plural magnetic disk substrates in a treating vessel with an ultrasonic vibrator on the outside surface. CONSTITUTION:An oscillating shaft 3 consisting of two circular surface 8 and 9 each having a different radius of curvature is protruded from the lower end of a T-shaped frame 4 in an electroless nickel plating liq. 30 in a treating vessel 1 lined with a polyfluoroethylene layer 2, and plural recessed grooves 10 are furnished to the shaft to support plural magnetic disk substrates 20 in parallel, and out of contact with each other. The frame 4 is rotated by a revolving plate 6 through a bearing 5 and a crank pin 7, the oscillating shaft 3 is rotated and allowed to follow a cricumferential course, and the substrate 20 is rotated around the oscillating shaft 3 having a non-circular cross section. An auxiliary vessel 11 is further provided, and ultrasonic vibration is produced by a vibrating plate 12 attached to the outer side surface of the treating vessel 1 and an ultrasonic vibrator 13. Consequently, the whole outer surface of the substrate 20 is plated without any defects such as pits.
申请公布号 JPS61104082(A) 申请公布日期 1986.05.22
申请号 JP19840224928 申请日期 1984.10.25
申请人 CHUO SEISAKUSHO:KK 发明人 OHASHI HIDEHIRO;SUZUKI SHIRO;MIYAZAKI TOSHIHISA
分类号 C23C18/16;C23C18/31;C23C18/34;G11B5/858 主分类号 C23C18/16
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