| 摘要 |
PURPOSE:To enable the mass production of the cooler with the high-density arrangement of fine coolant paths which has a large area of heat transfer and high cooling efficiency, by a method wherein photoetching is adopted for the formation of cooling grooves serving as junction coolant paths. CONSTITUTION:A copper plate of 0.5mm thickness and a plate of 0.5mm thickness comprised of 10 pieces of cooling-groove patterns 0.1mm wide and 0.1mm deep formed by photoetching are prepared and loaded into a vacuum chamber. After the junction plane is cleaned by irradiation with Ar ion beams, a Cu-30wt%Ti alloy film is deposited 2mum by sputter evaporation. These films are laminated, loaded into a diffusion furnace, and subjected to 1hr junction under a junction pressure of 0.2kg/mm<2> at 940 deg.C into an integral body. Then, coolers are produced by cutting each cooling-groove pattern; finally, pipes serving as coolant inflow-outflow ports are brazed, thus completing the coolers. |
