| 摘要 |
PURPOSE:To enable connection even at narrow intervals by unnecessitating insulation coating by facilitating the wiring of re-connected metallic fine wires by a method wherein the back of a semiconductor chip subjected to facedown bonding is provided with a relay wiring means that connects electric functions with each other. CONSTITUTION:The relay wiring means 12 consists of an insulation film 13 formed on the back of a semiconductor chip 11 and a relay wiring 14 formed thereon out of aluminum. The relay wiring 14 consists of several pieces of pattern, and each terminal is located in each periphery of the square semiconductor chip 1. Internal wirings 4 are connected so as to compound the functions of a plurality of semiconductor chips 11. In case of functional change, the internal wiring 4 is cut as required, and internal wirings 4 corresponding to design change are connected to each other by wire bonding with metallic fine wires 15 which are ultrafine bare wires. Such a manner of selecting the pattern arrangement of the relay wirings 14 and the bonding positions of the metallic fine wires 15 enables connection without the intersection of a plurality of re- connections without crossing semiconductor chips 1. |
