| 摘要 |
PURPOSE:To improve moisture resistance by providing a resin frame to the outer edge or to the outside of a metal cap. CONSTITUTION:In a basic structure, a mount part is provided on one surface of a glass or epoxy resin substrate 5, and a semiconductor chip 4 is mounted by a resin having a low thermal expansion coefficient. A wiring pattern is provided at the outside of the mount part on the surface. The periphery of the mount part forms a bonding pad. A resin frame is bonded to the periphery of the bonding pad by a thermosetting resin, which has a low thermal expansion coefficient and excellent moisture resistance. The resin frame 2 has a shape along the shape of a metal cap 1 from the inside of the contraction of the metal cap 1 to the outer edge of the metal cap 1 so as to prevent intrusion of moisture. |
