| 摘要 |
An ultrasonic detection sensor having an integrated structure and formed of a substrate such as used for thick film circuits on which is secured at least one ultrasonic transducer formed of a film packet having n piezo ceramic films and n+1 plastic films. One outermost plastic film layer is secured to the substrate, serving as a backing for the transducer, and a thick film electrical circuit is formed on the same substrate. |
