Polyphenylene ether resin composition suitable for electroless plating

摘要

A polyphenylene ether resin composition comprising: (a) a polyphenylene ether resin, (b) a polystyrene-type resin, (c) an A-B-A' type elastomeric block copolymer, wherein A and A' represent blocks resulting from polymerization of an aromatic vinyl compound, and B represents a block resulting from polymerization of a conjugated diene compound, and (d) an elastomeric stryene/butadiene random copolymer, which is suitable electroless plating. Molded articles formed by using the resin composition of this invention can be plated using conventional electroless plating processes for ABS resins.