Automatic wafer prober having a probe scrub routine

摘要

In an automatic wafer prober, the prober steps through a certain predetermined sequence of die on the wafer. After a certain predetermined number of die have been probed, the prober automatically interrupts the probing sequence and steps the prober off of the wafer onto an abrasive element for scrubbing clean the probe tips. Thereafter, the prober returns to its predetermined probing sequence. The abrasive element is preferably fixidly secured to the wafer chuck. A flat of the abrasive element serves as an alignment flat for registration with a flat of the wafer.