| 摘要 |
PURPOSE:To equalize the size of a pattern in a wafer surface by arranging a plurality of nozzles in the radial direction, separately controlling the temperature and quantity of a developer fed from the nozzles and rotatably applying the developer. CONSTITUTION:Several developer dropping nozzles 3 are mounted in the radial direction of a semiconductor substrate 2, and the temperature and flow rate of a developer fed from each nozzle are controlled independently. Accordingly, the developer dropped from respective nozzle flows on the surface of the substrate 2, and is mixed with a novel developer dropped from the next nozzle with a proceeding to the periphery, thus compensating a temperature change, then reducing the width of temperature distribution to one over several of conventional devices, provided that a pattern in uniform size is acquired in a substrate surface. |
