| 摘要 |
Disclosed is a composite of a polyaramid woven fabric and a resin. The resin contains water, a water-based emulsion of an epoxy selected from the group consisting of diglycidyl ethers of bisphenol A, diglycidyl ethers of bisphenol F, novolacs, and mixtures thereof, water-compatible curing agents for the emulsion, and a water-compatible catalyst for the emulsion. The emulsion can be cured to the B-stage to form a prepreg and prepregs can be stacked with copper sheets and heated and pressed to form a laminate for use in making a printed wiring board.
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