| 摘要 |
PURPOSE:To enlarge the contact space between the mounting plane of substrate and solder in case of actual mounting assuring direct mounting on the substrate without forming a hole at all by a method wherein the actual mounting space is enlarged by means of bending the ends of pins for mounting the substrate. CONSTITUTION:A pellet 3 is mounted on the central surface of substrate 2 made of alumina utilizing a bonding agent 4 comprising gold-silicon eutectic while bonding pads 5 are formed on the pellet 3. The bonding pads 5 are electrically connected to metallized layers 6 formed on the substrate 2 using wires 7 made of gold, etc. Besides, multiple pins 8 for mounting substrate 2 electrically connected to the metallized layers 6 are fixed on the backside of substrate 2 while the ends of pins 8 are bent to sufficiently enlarge the mounting space on the substrate 2. |
