| 摘要 |
PURPOSE:To prevent the unnecessary flow out of solder by a method wherein a weir of resin is provided on the circumference of the part where a transistor is fixed before a solder feeding process is performed, and the chip is adhered using solder. CONSTITUTION:A jig 11 having a square-shaped tip is brought to come in contact with the resin on a plate 13. The jig 11 is raised, and the resin 12 is attached to the tip of the jig 11. The jig 11 is contacted to a metallized layer 2 located on a container substrate 1. When the jig 11 is raised, a weir 14 of resin is formed on the metallized layer 2. As a result, the unnecessary flow out of solder can be prevented. |
