| 摘要 |
PURPOSE:To contrive a lower cost through simplifying construction, by providing recessed grooves and heating resistors on a substrate in a back-to-back relationship, and providing the heating resistors at a flat part of the substrate. CONSTITUTION:The back side of the substrate 1 is covered by an oxide insulating layer 2 of silicon dioxide (SiO2). On the face side of the substrate 1 are provided a heat action chamber 1a, a passage chamber 1b and an intermediate chamber 1c as recessed grooves. These grooves and a through-hole 2a can be easily provided by a photolithographic process. On the flat back of the substrate are provided thermo-electric converters such as a heating resistor 3, a common electrode 4 and selective electrodes 5. The converters and an insulating protective layer 6 are provided by a thin film producing technique. Therefore, a predetermined pattern can be provided by sputtering or a combination thereof with other means. An orifice plate 7 is provided with an ejecting orifice 7a at a position corresponding to a heating dot part. The orifice 7 can be easily formed from a thin plate of stainless steel or brass by pressing work. The substrate 1 and the orifice plate 7 are adhered to each other by an adhesive, whereby a construction comprising the heat action chamber 1a, the passage chamber 1b and the intermediate chamber 1c is obtained. |
