发明名称 MOLDING DEVICE
摘要 PURPOSE:To suppress a force to make a distortion generate in a work when the work is pressed to a pair of press parts by a method wherein the configurations of a pair of the press parts to suppress the work from both sides at the molding time of the work are formed in a configuration to roughly fit to the surfaces to be suppressed of the work. CONSTITUTION:An IC1 is set in such a way that the IC1 is inserted in a bottom force 11 and the lower half of the package 2 of the IC1 is inserted in a recessed part 15 in such a state that the package 2 is being faced upwards. The lower face of the basic end part of each outer lead 7 of lead frames 3 is made to adhere closely to a lower press part 17 along the lower press part 17 and each dam 8 is made to match to each lower blade 19. An upper press part 16 and the lower press part 17 grasp the lead frames 3 between them along the warpage configuration of each lead frame 3. Accordingly, a force to correct the crook of each lead frame 3 does not act on the lead frame 3. As a result, a possibility of the generation of a failure of the package 2 and a crack, which is generated in a pellet 4, or a possibility of the generation of gaps, which are generated on the interfaces between the package 2 and the lead frames 3 due to deviation, can be avoided.
申请公布号 JPS61101064(A) 申请公布日期 1986.05.19
申请号 JP19840222197 申请日期 1984.10.24
申请人 HITACHI MICRO COMPUT ENG LTD;HITACHI LTD 发明人 MATSUZAWA ASAO;KIYONO MASAMI;HIRAI MICHIO;CHIBA TOSHIYUKI;KOMURO MASAMICHI
分类号 H01L23/50;H01L21/50 主分类号 H01L23/50
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