发明名称 MANUFACTURE OF INTEGRATED CIRCUIT
摘要 PURPOSE:To enable to easily find a defective lead terminal of each string of lead terminals by a method wherein each lead terminal of a connected group of lead terminals is held in a conductively independent state in advance and before the string of lead terminals is sealed using a resin, a checking on the electric characteristics of each lead terminal is performed using an independent lead terminal. CONSTITUTION:Each group 11 of lead terminals has an island 1, whereon an integrated circuit chip[ 5 is mounted, and lead terminals 2 and 2 disposed in such a way that the points of the lead terminals 2 and 2 gather around the periphery of the island 1. A large number of the string of lead terminals sectioned by unit in such a way as to correspond to one integrated circuit are formed in a row continuously in a multi tape form by a coupling strip 3 and an insulative tie bar 4. The integrated circuit chip 5 is mounted on each island 1, and the electrodes of the chip 5 and the inner end parts of the lead terminals, which correspond to the electrodes of the chip 5, are mutually connected using fine metal wires 6. The connecting lead of a tester 7 is connected to the lead terminals 2 and 2 and the island supporting lead and a check on the lectrical characteristics of the lead terminals is performed. At this time, when a defective lead terminal is found, the defective is repaired or exchanged. Then, a sealing is performed on each group of lead terminals sectioned by unit using a sealing resin 8, the supporting lead is cut off and the insulative tie bar is removed.
申请公布号 JPS61101066(A) 申请公布日期 1986.05.19
申请号 JP19840223217 申请日期 1984.10.24
申请人 NEC CORP 发明人 ONO KENICHI
分类号 H01L23/50;H01L21/50;H01L21/66 主分类号 H01L23/50
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