| 摘要 |
PURPOSE:To prevent lead frames from bonding with one another in case they are laminated by a method wherein a bonding post to be plated is provided on the position lower than any other part on the lead surface. CONSTITUTION:A recession 7 as a bonding post is formed on the part near end of lead 5 to gold-plate the bottom of recession 7. In such a constitution of gold plating 8 lower than the surface of other leads, even if multiple lead frames are deposited, the gold plating 8 may not come into contact with the surface of other lead frames resulting in preventing lead frames from bonding with one another. |
