| 摘要 |
PURPOSE:To improve moisture resistance and to improve reliability of a semiconductor device, by forming a tapered surface or a gentle convex shape facing upward at the upper edge part of a pellet of a semiconductor element, and packaging the part by resin mold. CONSTITUTION:The angle of the tapered plane of an upper edge part 3 of a pellet 1 of a semiconductor element is made to agree with the angle of the inner surface of a collet 14. When the surface is formed in a curved shape facing the upward direction, the inner surface 15 of the collet and a tapered surface 3 face to each other and the surface contact state is obtained, even if the collet 14 holds the pellet 1. Therefore, a void is not formed on the upper edge part of the pellet 1. Even if the pellet 1 is fixed to a lead frame 12, a silicon piece is not attached to the gold heating of a lead 16 and the eutectic of gold and silicon is not formed. Excellent contact of wire 17 is obtained. A mold 19 is completed by a resin 18. Even if heat hystory is received and stress is yielded between the resin 18 and the pellet 1, the stress is not concentrated at the upper edge part. Thus the yield of resin cracks can be prevented, intrusion of water can be prevented and moisture resistance can be improved. |
