| 摘要 |
<p>PURPOSE:The title mixture that is composed of a reaction from an epoxidized acenaphthene-modified phenolic resin and acrylic or methacrylic acid, thus giving an ultraviolet-curing type resin composition which is suitable for use as a solder-resist ink with high heat, plating, moisture and solvent resistances. CONSTITUTION:The objective mixture is obtained by reaction of (A) an epoxidized phenolic resin modified with acenaphthene with (B) (meth)acrylic acid, preferably at a molar ratio of /(0.9-1.1). This mixture is mixed with a (meth)acarylate monomer containing (meth)acaryloyl groups in the molecule and a photosensitizer to give an ultraviolet-curable type of resin composition which is suitable for used as a solder-resist ink.</p> |
