| 摘要 |
PURPOSE:To contrive improvement in the dampproof property and the stability of electric connections of the title device by a method wherein a coil terminal is fixed by a resin molding at both sides of a printed circuit board in addition to the fixing by soldering. CONSTITUTION:A through hole 9, to be used for lead out of a coil terminal 2, is provided on the printed wiring 7 formed on a printed circuit board 8. The coil terminal 2 is positioned on the printed wiring 7 by leading out the tip of the coil terminal to the back side of the printed circuit board 8 from the through hole 9. The connection of the coil terminal 2 can be performed easily by performing a soldering. Also, the coil terminal 2 led out to the back side of the printed circuit board 8 can be fixed in a resin molded body 3 without performing an after treatment by having a coil 1 and the board formed in one body by performing a resin molding. |
