| 摘要 |
PURPOSE:To stabilize performance characteristics and to prevent fluctuations in the circuit constant of a passive circuit element by a method wherein the heat generated by an active circuit element is radiated efficiently and the transmission of the heat to a passive circuit element is suppressed by a heat- insulating resin layer. CONSTITUTION:The surface of an aluminum plate 1 is covered by an electrical insulating resin layer 2, whereto a semiconductor element substrate is fixed with an adhesive agent. To a circuit substrate die bond section 3 composed of a first conductive pattern, a semiconductor integrated circuit substrate 4 is fixed. An electrode on the semiconductor integrated circuit substrate 4 is connected to a wire bond section 311 by a fine metal wire 5 and, on top of them, a heat-insulating resin layer 6 is formed. Further, on the heat-insulating resin layer 6, a second conductive pattern is formed, composed of passive circuit element mounts 7, 71 and a wiring section 71. A passive circuit element 8 is installed between the passive element mount 7 and 71. A connecting member 9 runs through a through-hole and connects a wiring section 32 with another wiring section 72. |
