摘要 |
PURPOSE:To make it possible to improve grinding performance and to strongly hold abrasive grains on a base metal by plating thickly to hole the abrasive grains lying deeply in a plate layer, and then removing only the plated layer to form a desired chip pocket. CONSTITUTION:A base metal is plated with nickel etc. so thick as abrasive grains become out of sight. Emery abrasive grains etc. are injected over a plated layer 3 on a side holding abrasive grains 2, and thus only the plated layer 3 is removed to form a large chip pocket 4. Such a large chip pocket 4 is formed to improve the grinding performance of an electrodeposited grindstone, and the thick plated layer 3 near the abrasive grain 2 can strongly hold the abrasive grain 2 on the base metal 1. |