| 摘要 |
PURPOSE:To absorb the clearance between a chip material and a die for casting and to prevent the crack of the chip material by interposing a thin-walled metallic material between a hard sintered alloy layer formed on the surface of the chip material and the contact surface of the die for dicasting and embedding the chip material by casting. CONSTITUTION:The thin-walled soft metallic layer 6 is inserted between the hard sintered alloy layer 4 on the surface of the chip material and the contact surface of the die 8 for die casting in the range of embedding, by casting, the chip material 2 formed thinly with the hard sintered alloy layer 4 on the surface of a ferrous base material 3 and therefore the layer 6 acts as a cushion material when a molten metal is poured under the pressure into the residual cavity 10 of the die 9 for die casting. The clearance between the layer 4 and the contact surface of the die 8 is thus absorbed and uniform external force is exerted to the layer 4, by which the generation of the crack to the material 2 from the alloy layer 4 on the surface thereof is prevented. |
