| 摘要 |
<p>PURPOSE:To prevent the waste of silicon etc. from sticking on the surface of a pellet, by applying a laser beam into a cut groove formed in a wafer by half-cutting, so as to pelletize the wafer. CONSTITUTION:A wafer 1 is half-cut along a cutting line of each pellet unit by a dicing saw 5, so as to form cut grooves 6. Next, a laser beam 8 is applied from a laser light source 7 into each of the cut grooves 6 in a substrate 2. An uncut portion 2a and a back electrode 4 are melted by the laser beam 8, and thus the wafer 1 is separated into individual pellets 9. By this method, pelletizing can be conducted without using mechanical cracking, occurrence of an extraneous substance due to breakage of silicon etc. can be eliminated, and the sticking of this substance on the surfaces of the pellets can be prevented.</p> |
