| 摘要 |
<p>A heat dissipation for electronic components 12 comprises a ceramic plate 20 having a first surface for receiving heat from the electronic components and a plurality of separate, spaced metallic, heat- conducting elements 24 mounted on and extending from a second surface of the ceramic plate 20. The electronic components may be mounted directly on the first surface of the ceramic plate 20 or on a ceramic substrate 10 which is secured by adhesive 22 to the ceramic plate 20. <IMAGE></p> |
