发明名称 METHOD FOR ADJUSTING EJECTION HEIGHT OF SOLDER IN SOLDER TANK
摘要 PURPOSE:To adjust exactly the ejection height of solder and to make possible soldering with uniform quality by maintaining a contactor provided vertically movably and perpendicularly in the upper part of a solder tank at a prescribed height and detecting electrically the contact between the ejected solder and the contactor. CONSTITUTION:A height gage 42 is operated to lower the contactor 38 and to bring the top end thereof into contact with a nozzle 34 while the solder 36 is not ejected from the nozzle 34. The position thereof is read by the gage 42 and is determined as a reference level. The gage 42 is then operated to set the top end of the contactor 38 at the required ejection height of the solder tank 36 and the solder 36 is ejected. The adjustment of the solder ejection height in this stage is executed by operating a knob provided to the tank 32 so as to increase gradually the ejection height from the lowest level. The contactor 38 is once risen when a lamp 44 lights up and again the contactor is lowered. The position where the lamp 44 lights up again is read with the gage 42 and the value thereof is accepted if said value is within the set tolerance. The contactor 38 is held retreated after the end of the adjustment.
申请公布号 JPS6195768(A) 申请公布日期 1986.05.14
申请号 JP19840219167 申请日期 1984.10.17
申请人 KOJIMA PRESS CO LTD 发明人 KOJIKA KATSUYA;HAYASHI NORIO
分类号 H05K3/34;B23K1/08;B23K3/06 主分类号 H05K3/34
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