| 摘要 |
<p>PURPOSE:To inspect characteristics by making a wafer in airtight contact with a conductive film and by electrically connecting an electrode from the substrate of the wafer to a measuring instrument. CONSTITUTION:The wafer after an element is formed is adhered to conductive film 3 and divided into pellets 1, and then the film is elogated and connected to metal ring 2, so that a constant interval will be produced among pellets. Metal ring 2 is connected to the measring instrument and measurements of the element are made by probe 4, thereby fulfilling definite quality selection with high efficiency.</p> |
