| 发明名称 |
Thermally conductive heat curable organopolysiloxane compositions |
| 摘要 |
This invention relates to thermally conductive heat curable organopolysiloxane compositions containing from 30 to 95 percent by weight of filler based on the weight of the composition of which at least 10 percent by weight of the filler is silicon nitride particles.
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| 申请公布号 |
US4588768(A) |
申请公布日期 |
1986.05.13 |
| 申请号 |
US19840665576 |
申请日期 |
1984.10.29 |
| 申请人 |
SWS SILICONES CORPORATION |
发明人 |
STREUSAND, MARIE J. |
| 分类号 |
C08L83/00;C08K3/34;C08K5/14;C08K13/02;C08L83/04;(IPC1-7):C08K3/34 |
主分类号 |
C08L83/00 |
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