| 摘要 |
<p>In order to protect an integrated circuit accommodated in a flat support, such as especially an electronic identification card, from electrostatic charges, it is well known to cover the two faces of this circuit with a conducting foil. The problem, which then arises, consists in the interconnection of the foils covering each of the faces. The present invention overcomes this problem by providing a method which interconnects the foils by forming a hole in the support between the two aforementioned foils, causing a part of the material of the surface foils to penetrate into this hole, exerting a pressure and simultaneously carrying out a thermal treatment on the foil in the vicinity of the hole.</p> |
