发明名称 MANUFACTURE OF RESIN SEAL TYPE SEMICONDUCTOR DEVICE AND LEAD FRAME USED FOR SAID MANUFACTURE
摘要 PURPOSE:To cut strips lead out of a support plate by small tensile force by forming a non-connecting section to a connecting strip connecting the strips, dividing the connecting strip into a plurality of units and cutting the strips at every unit. CONSTITUTION:A lead frame 1 has support plates 2, each section lead L and strips 10. Small sectional sections 13 are formed on the outsides from shoulders 12 shaped to the strips 10. Minimum sectional sections 15 are formed to the small sectional sections. A connecting strip 11 is connected rectangularly at the outer ends of the strips 10. The strip 11 is divided into a plurality of units by non-connecting sections 16. The whole is cut at every strip 11 divided into a plurality of the units in the next process in which the strips 10 are cut after a resin seal process. The strips are cut in the minimum sectional sections 15 by a punch on the cutting. A large number of the strips 10 are cut continuously at every unit from the end of the lead frame 1 at that time. The strips 10 are cut at every unit according to such a method, thus reducing tensile force required for cutting.
申请公布号 JPS6194349(A) 申请公布日期 1986.05.13
申请号 JP19840215235 申请日期 1984.10.16
申请人 SANKEN ELECTRIC CO LTD 发明人 YOSHIDA SADAO
分类号 H01L23/48;H01L21/48;H01L21/56 主分类号 H01L23/48
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