| 摘要 |
PURPOSE:To produce the titled composition having excellent heat-resistance, thermal discoloration resistance and adhesivity to copper foil, and useful for printed circuit board, etc., by laminating a prepreg composed of an epoxy resin composition containing a specific novolac resin. CONSTITUTION:The objective laminated sheet can be produced by laminating a metallic foil to one or both surfaces of a B-stage prepreg or its laminate composed of an epoxy resin composition containing (A) an epoxy resin having >=2 epoxy groups in the molecule, (B) a novolac resin of formula (R1 is alkyl or aromatic group; R2 is alkyl; n is 2 or 3) and (C) an imidazole compound as a cure-accelerator, as essential components. |
