| 摘要 |
PURPOSE:To prevent damage from occurring on the mirror face of a semiconductor wafer, by providing with a plural of projections made of resilient material, each having a ring shape for supporting the mirror face of the semiconductor wafer on cushion pads. CONSTITUTION:A plural resilient material made projections each having a ring shaped for supporting the face of a semiconductor wafer 5 are provided on cushion pads 1 respectively. The pads 1 are put on a resin-made turn table through which exhausting holes 4a for slurry are being formed. The pads 1 support the semiconductor wafer 5. Thus damage can be prevented from occurring on the mirror face of the wafer 5. |
