| 摘要 |
PURPOSE:To improve solderability and to facilitate mass production by forming preliminarily a thermally sprayed film of a conductive material having good wettability with solder to a lead wire. CONSTITUTION:Electronic parts are constituted of a heat radiating plate 1, lead wires for external connection having poor solderability and a resin package 3, etc. The conductive material 8 such as copper or nickel having good wettability with solder is thermally sprayed from a thermal spraying device 7 to the lead wire 2 for external connection to form a thermally sprayed film 9 on the surface thereof. The uniform film 9 is formed by rotating the electronic parts or turning the device 7 around the electronic parts. The lead wire 2 having the poor solderability has the good wettability with solder when the film 9 is formed thereon by the above-mentioned method. The solderability is thus improved and since the treating method is easy, the mass production is easy as well. |
