| 摘要 |
PURPOSE:To irradiate the overall periphery with the light emitted by light emitting bodies by means of providing both sides of insulating substrate with light emitting diode chips. CONSTITUTION:Metallic wires 31, 32 made of copper or aluminum etc. with protruding parts thereof beyond the surface of substrate 1 calked are inserted into holes 21 and 22 respectively opened at the central part and the end of insulating substrate 1 made of ceramics of epoxy resin etc. containing glass fiber. Both ends of caulked metal wires 31, 32 are formed into flat planes in parallel with each other to be silver-plated while light emitting diode chips 41, 42 are respectively bonded on the flat planes at both ends with conductive adhesive. Finally the light emitting diode chips 41, 42, conductive wires 61, 62, the metallic wires 31, 32 and a part of lead wires 51, 52 are covered with transparent resin 7 to be bonded on the substrate 1 by means of heating process etc. |
