| 摘要 |
PURPOSE:To prevent the generation of a purple plague due to the heat history of sealing by a method wherein a gold eutectic alloy layer is formed on the gold-metallized layer formed on a ceramic substrate, and an outer lead and the gold eutectic alloy layer are connected to an aluminum fine wire. CONSTITUTION:A gold-metallized layer 22 is formed on the center recessed part of a ceramic substrate 21, an IC chip 23 is rubbed against the layer 22, and a gold-silicon eutectic alloy 25 is grown and fixed. At this time, the gold- silicon eutectic alloy 25 is to be formed as far as to the point where a wire connection is performed on the gold-metallized layer 22. Then, each electrode of the IC chip 23 and a substrate potential are connected to an outer lead 27 using aluminum fine wires 26 and 26'. Subsequently, a ceramic cap 28 is adhered to the ceramic substrate using a low melting point glass 29, and the IC chip 23 is airtightly sealed. |
