PACKAGE FOR SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To prevent short due to die-bonding from occurring, by forming selectively nonexistence portions of a second material, in composite material consisting of a first material and the second material melted into the first material. CONSTITUTION:A package member 1 is made of composite material in which second material (shaded section) having a lower melting point than that of a first spongy foaming material (slant lattice section) is melted into the first material. At this time, nonexistence portions 2 of the second material are formed. When a semiconductor device 5 is die-bonded with conductive material 4, the material 4 is absorbed into the nonexistence portions 2 so that it is not deposited to the periphery of the device 5. Thus resulting in short can be prevented.