发明名称 METHOD FOR SUBJECTING PLASTIC TO ELECTROLESS PLATING
摘要 <p>PURPOSE:To form plating having superior adhesion and a fine appearance on plastics by electroless plating by forming an undercoat layer contg. synthetic rubber and an overcoat layer contg. ABS resin on the surface of the plastics before electroless plating. CONSTITUTION:A film contg. one or more kinds of synthetic rubber such as nitrile rubber, chloroprene rubber and urethane rubber is formed on the surface of plastics to be subjected to electroless plating. A film contg. ABS resin is further formed, and etching and electroless plating are carried out. The total thickness of the films formed on the surface of the plastics is >=1mum.</p>
申请公布号 JPS6191364(A) 申请公布日期 1986.05.09
申请号 JP19840213987 申请日期 1984.10.12
申请人 SEIKO EPSON CORP 发明人 TODA SHIGEO;ARAYA YUTAKA
分类号 C23C18/20;(IPC1-7):C23C18/20 主分类号 C23C18/20
代理机构 代理人
主权项
地址