AUTOMATIC LAPPING SYSTEM OF WAFER LAPPING MACHINE

摘要

PURPOSE:To improve the productivity and to maintain the high quality of products by changing the speeds of upper and lower surface plates and a carrier from high speed to low speed with abrasive grain slurry being supplied and by stopping the machining according to the out put signals from a constant dimension detector. CONSTITUTION:An upper surface plate 1 goes down from an upper limit position at a high speed and then at a low speed with the speed changed according to the signals detected by a position sensor 13 and is rotated with its hook 23 engaged with a drive shaft 7. Then timing, when the upper surface plate 1 going down at a low speed is brought into contact with an wafer 4, is detected by the sequencer of a controlling section supplying abrasive grain slurry between the upper surface plate 1 and a lower surface plate 2 through a ring shaped path 17. Drive shafts 7-10 are rotated at a low speed to rotate the upper surface plate 1 and the lower surface plate 2 and a carrier 3 at a low speed. With drawing to the time of a counter pressure timer the rotary speeds of the drive shaft 7-10 vary to high speed until the counter pressure timer is turned off, and consequently the surface plate 1 is lowered at a low speed to grind wafers 4... and stops the machining according to the out put signals from a constant dimension detector 15.