| 摘要 |
PURPOSE:To miniaturize a handler for taking a wafer in and out a wafer carri er, by providing such an arrangement that a wafer supporting member is moved by a pair of arm assemblies which are folded by a timing belt. CONSTITUTION:A gap between a desired wafer 7 to be taken out a finger 5 and an adjacent wafer 7 is detected by a wafer position detecting mechanism composed of a laser source 16, a laser 20, a mirror 18, a half-mirror 17 and a photosensor 19, and then the fingers 5 are set at a predetermined position. When a shaft 9 is rotated by a handarm extending and retracting drive section 21, a timing belt 10 and pulleys 11, 14 are moved relative to each other. With this arrangement arms 12 are moved such that they are folded about the axis of the pulley 11. In this arrangement, the diameter ratio of the pulleys 14, 11 is set at, for example, 2:1, the finger 5 may be rectilinearly moved. Thus, it is possible to shorten the length of the arms to miniaturize the handler. |
