| 摘要 |
PURPOSE:To restore and stabilize brightness in a short time by applying high pressure to an external lead unit after bonding of a drive IC chip by providing diodes between connecting wires of an external lead unit for aging and a drive circuit. CONSTITUTION:A diode alley 20 is bonded to be fit between connecting wires of an output terminal 13 and an external outgoing terminal 12 so as to be biased in the forward direction seen from the terminal 13. The alley 20 is made not to apply high voltage to an IC chip 11 when aging of a segment electrode 4 is carried out by applying high pressure to a lead 7' for external outgoing. As the result, as for brightness lowering phenomenon generated in bonding of the chip 11, high voltage is applied to the lead 7' again and brightness can be restored in a short time. |
