发明名称 THIN FILM HEAD ASSEMBLY
摘要 PURPOSE:To make a connection with external wiring easy and improve durability by setting the height of a board on which thin film pattern is formed larger than the thickness of slider part. CONSTITUTION:A board 2 with a thin film pattern formed on it is attached to a slider 1 at the thin film pattern formed surface 3. The height (h) of the board 2 is set larger than the thickness (t) of the slider 1, and a wiring on the board is connected to the external wiring at the place A. This makes the connection with the external wiring easy, and since the thin film pattern is protected by the thick board 2 and slider 1, its durability can be increased.
申请公布号 JPS6190320(A) 申请公布日期 1986.05.08
申请号 JP19840209712 申请日期 1984.10.08
申请人 HITACHI LTD 发明人 SHIIKI KAZUO;SHIROISHI YOSHIHIRO;YUHITO ISAMU;NAKAMURA HITOSHI;HAMAKAWA YOSHIHIRO
分类号 G11B5/31;G11B5/60;(IPC1-7):G11B5/60 主分类号 G11B5/31
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