发明名称 SUPPLIER OF LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable lead frames to be split surely one by one without deformation by providing the first stopper member that supports the lead frame bottom and the second stopper member that comes into a gap between the lowermost part and the lead frame just above. CONSTITUTION:A lead frame 31 contained in a magazine 30 is supported by the first stopper member 38. Next, the second stopper member 42 and a push- down member 46 are advanced and come into a gap between the lowermost part and the lead frame just above. Next, the stopper member 38 is moved backward, and lead frames above the second stage from bottom are supported by the stopper member 42, bringing the lowermost lead frame into a free state, when the push-down member 46 is pushed down, and the lowermost lead frame is separated, dropped, and guided onto a welding jig 32. Since two members share in the support and separation of lead frames in such a manner, the push- down member surely separates lead frames without deformation and can supply them onto the welding jig.
申请公布号 JPS6190438(A) 申请公布日期 1986.05.08
申请号 JP19840212823 申请日期 1984.10.11
申请人 SHINKO ELECTRIC IND CO LTD 发明人 OGAWA YOSHIHIKO
分类号 H01L21/50;(IPC1-7):H01L21/50 主分类号 H01L21/50
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