| 摘要 |
PURPOSE:To accurately secure with a simple device by forming a metal film having good wettability of soft brazing material on the back surface of a wafer and a region for securing a chip, placing a thin soft brazing piece on the metal film of a package, placing, heating and securing the chip thereon. CONSTITUTION:A metal film 22 having good wettability of soft brazing material is bonded to the back surface of a chip 21, and a metal film 24 is coated on a region for securing a chip on the upper surface of a package 23. The film 24 is made of a material having good wettability of soft brazing material, and formed by metallizing. Thin soft brazing pieces 15 of the prescribed length are cut by a brazing material supply unit 8, and plated on the film 24 on the package 23. A bonding head 28 is moved forward and dropped to attract the chip 21 disposed directly under 29 after attracting by an X-Y table, and the chip 21 is placed on the piece 15 of the film 24 of the package 23 by attracting to 29 after rising, retarding and dropping the head 28. Thus, the head 28 is returned upward, the package 23 placed with the chip 21 is intermittently conveyed by a conveyor 27, and fed to the conveyor 33 of a heater 32. |
