A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE WITH AN IMPROVED HEAT SINK

摘要

A semiconductor device is disclosed with a multipackage structure in which a plurality, for example four, of IC packages (2) are mounted on a single mother board (6). The mother board has multi-layer interconnection circuits which connect the IC packages to appropriate pin terminals (7). The invention lies in the heat sinks (1), each of which is attached by brazing or epoxy resin to its respective IC package. Each heat sink (1) includes a highly conductive column (11 min ) perpendicular to the mother board, and disk-shaped heat-dissipating fins (3) parallel to the mother board.