Deposition of patterns using laser ablation.

摘要

An improved technique is described for the formation of conducting patterns on substrates. This technique has particular utility in the provision of "seeding" layers which are often used as catalysis for electroless deposition of an overlying metal layer. The seed layer is provided by casting a polymer containing a seed constituent onto a substrate, after which the polymer is ablatively photodecomposed by far UV radiation of wavelengths less than 400 nm and sufficient energy fluence to create ablative photodecomposition. This exposes the seed constituent in the polymer in the irradiated areas. Electroless plating of a metal can then occur, the plating being limited to only those areas which have been selectively exposed by the laser irradiation. Thus, a seed layer is prepared by dry processing, in contrast with previous techniques using plating solutions to provide the seed layer.