| 摘要 |
PURPOSE:To improve an utilization efficiency of an UV lamp consuming a large power by utilizing the same UV projection apparatus in a pre-treatment and drying processes commonly. CONSTITUTION:A semi-conductor apparatus being transported by an autoloader is transported in an UV projection apparatus 1, and UV rays having an energy exceeding the energy being produced by the chemical combination of the molded epoxy resin are projected. Concretely, the mold surface is activated and cleaned by the projection of UV rays during about 5-10sec. Then it is transported in a printing apparatus 2. The printed semi-conductor apparatus is transported in the UV projection 1 again. An UV ray curing type ink is used in a printing, and a drying process is carried out by the projection of UV rays during about 5-10sec. |
