| 摘要 |
PURPOSE:To relax the limitation of a connection, and to improve area efficiency by boring a through-hole to a semiconductor chip positioned at an upper section, flowing solder into the through-hole and mutually connecting two semiconductor chips each having circuits and the pads through insulating films on surface layer sections when the chips are superposed and chip-on-chip structure is formed. CONSTITUTION:An insulating film 1c is applied onto the surface of a semiconductor substrate 16 to which a circuit is formed, a connecting pad 3a is shaped onto the film 1c, and the pad 3a is surrounded by an insulating film 1d while being connected to the predetermined section of the circuit, thus forming a first semiconductor chip 1a. A second semiconductor chip 2a stacked onto the chip 1a is also constituted by a connecting pad 4a through a semiconductor substrate 2b and an insulating film 2c, but an opening 4b penetrating the pad 4a and a through-hole 6 penetrating the substrate 2b are bored to the chip 2a when the chips 1a and 2a are superposed. A lower hole 6a is also bored to the film 1d exposed into the hole 6, the side wall of the hole 6 is coated with an insulating film 6b, solder 5a is flowed into the hole 6, and the two pads 6 and 4a are connected with each other. |
