| 摘要 |
A method of covering a substrate which comprises (1) overlappingly wrapping a heat-shrinkable polymeric closure member in sheet form around an elongate substrate; (2) placing a crosslinked polymeric patch member over the exposed edge and outwardly disposed adjacent portions of the sheet in the area of the overlap; (3) interposing between the closure and patch members a layer of a hot melt adhesive; (4) heating the said hot melt adhesive to its tack temperature and pressing the patch member against the closure member, thereby bonding them together; and (5) heating the closure member to cause shrinkage thereof into circumferential contact with the substrate to conform generally to the shape of the substrate causing the patch member to stretch by at least 5% in the direction of shrinkage the method being carried out under conditions such that (a) said patch member remains bonded to said closure member throughout at at least the major portion of its length in the overlap area; and (b) at least part of said patch member is stretched by at least about 5% up to about 50% in the transverse (circumferential) direction.
|
