| 摘要 |
PURPOSE:To dissipate heat excellently, and to increase density by a method wherein a semiconductor chip is mounted onto one surface of a supporter, an electrode for the chip is connected to an inserting terminal fitted to the lower end surface of the supporter, a plurality of units manufactured in this manner are studded onto a mother board at regular intervals, and the inserting terminals are connected to receiving terminals for the board. CONSTITUTION:A semiconductor chip 2 is fixed onto one surface of a supporter 1, pads 3 fitted to the chip 2 are connected to first connecting terminals 4 as inserting terminals formed to the lower end surface of the supporter 1, and a plurality of units manufactured in this manner are studded onto a mother board 6 at regular intervals. The first connecting terminals 4 are connected to second connecting terminals 7 as receiving terminals set up to the mother board 6, thus manufacturing a multi-chip LSI. Accordingly, high-density constitution can be shaped while heat dissipation and repair are improved. |
