| 摘要 |
PURPOSE:To enhance the effect of protection film by providing two regions in different thickness to a protection film wherein the first region covers the circuit elements existing region and the second region surrounds the first region which is thicker than the second region. CONSTITUTION:A film 8 is a protection film not existing in the periphery of chip. A double layer with a protection film 7 forms first region, while only the protection film 7 is provided in the existing thickness in the periphery of chip as a second region. According to this structure, crack is not generated by a pressure of film 7 itself and there is no circuit element under the film 7 and therefore any defect due to external pressure is not generated. Meanwhile, the first region alleviates external pressure with the double layer structure and it does not cause any defect on the elements thereunder. A pressure of protection film itself is dispersed to the periphery and thereby crack is not generated. As a result, more effective protection film can be obtained. |
