Thermal head

摘要

A thermal head for a thermal printer and/or a thermal ink transfer printer having a substrate, a heater layer and a conductive lead layer on the substrate in which a protection layer covering the heater layer has been improved. According to the present invention said protection layer is made of polyimide resin which includes some hard particle of filler of SiC with a weight ratio to the polyimide solid in the range between 1.1 and 3.2. Since the present protection layer is provided with low curing temperature, the substrate of the present thermal head may be polyimide resin which is not heat-proof. Because of filler in the protection layer, that protection layer is wear-proof, although polyimide layer itself is not wear-proof.