| 摘要 |
PURPOSE:To bond a wire at the reverse side to the die bond side while holding a section not metallized by forming the section not metallized to one part of a metallized section of an electrode to which a semiconductor chip is soldered and preventing a flow of solder. CONSTITUTION:When the slitty section 9 not metallized is shaped to the collector electrode 33 first, solder does not flow to a wire bonding section 33b at the reverse side across the section 9 not metallized even when the transistor chip 5 is soldered to one die bond 33a. Accordingly, an emitter electrode 22 is formed continuously on the surface of an insulating substrate 1 first by metallizing a bridging section 22a in a crossover section of the emitter electrode 22 and the collector electrode 33, and the collector electrode 33 separated by said bridging section 22a can be connected electrically by a metallic thin wire 10 across said bridging section 22a. |
